The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2000

Filed:

Dec. 04, 1997
Applicant:
Inventors:

J L Tham, Irvine, CA (US);

Deepak Mehrotra, Thousand Oaks, CA (US);

James L Bartlett, Cedar Rapids, IA (US);

Mau Chung Chang, Thousand Oaks, CA (US);

Henry O Marcy, 5th, Camarillo, CA (US);

Kenneth D Pedrotti, Thousand Oaks, CA (US);

David R Pehlke, Thousand Oaks, CA (US);

Charles W Seabury, Calabasas, CA (US);

Jun J Yao, Thousands Oaks, CA (US);

Assignee:

Rockwell Science Center, LLC, Thousand Oaks, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04B / ;
U.S. Cl.
CPC ...
455 78 ; 455 81 ; 455 83 ;
Abstract

The passive components of a transceiver, such as transmit/receive switches, antennas, inductors, capacitors and resonators, are integrated together on a common substrate to form an integrated passive transceiver section, which, in combination with other components, provides a highly reliable, low-cost, high-performance transceiver. Micro-electromechanical (MEM) device fabrication techniques are used to provide low-loss, high-performance switches and low-loss, high-Q reactive components, and enable the passive transceiver section's high level of integration. The passive components are preferably integrated on a low-cost glass substrate, with transceiver circuits containing active components fabricated on a separate substrate; the separate substrates are interconnected to implement the RF/analog and analog/digital interface portions of a transceiver. Additional MEM switching devices permit multiple, parallel signal paths to be switched in and out of the transceiver circuitry as needed to optimize performance.


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