Method of mounting an integrated circuit on a printed circuit board

Abstract

A method of mounting an integrated circuit having a plurality of leads on a printed circuit board (PCB), by: removing foreign substances on the PCB; spreading a flux on lead patterns formed on the PCB; aligning the leads of the integrated circuit on the lead patterns on the PCB on which the flux is spread; soldering the leads and lead patterns by covering the part of a semiconductor chip of the aligned integrated circuit using a holding block and radiating an optical beam onto the whole surface thereof; and cooling the holding block and PCB which has been soldered, which prevents shorts and a poor contact generated by an earlier method. As the quality of soldering is enhanced and the lead is not pressured when soldering, the confidence of the integrated circuit after mounting is also enhanced. Moreover, by soldering all of the leads at one time, the operational time can be reduced.