The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2000

Filed:

Aug. 07, 1998
Applicant:
Inventor:

Judith Ann Prybyla, Edison, NJ (US);

Assignee:

Lucent Technologies Inc., Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438760 ; 438781 ; 427370 ;
Abstract

A method for improving the planarity of a layer of material formed on the surface of a topographic substrate, is disclosed. The layer of planarization material formed over the topographic substrate has a first area and a second area. The planarization material in the first area is proximate to the perimeter of the topographic substrate and surrounds the planarization material in the second area. The planarization material in the first area is partially solidified, so that the planarization material in the second area is substantially confined throughout the height of the planarization material in the first area and remains within the perimeter of the topographic substrate when the surface of the layer of planarization material is planarized. The planarization material is planarized by contacting such material with a flat surface of an object with sufficient force to transfer the surface flatness from the flat surface of the object to the layer of planarization material. A release material is optionally placed between the layer of planarization material and the object with the flat surface to facilitate separation of the flat surface of the object from contact with the layer of planarization material after planarization and solidification.


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