The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2000
Filed:
Sep. 02, 1998
Michinobu Maesaka, Omihachiman, JP;
Jyunji Oyama, Kyoto-fu, JP;
Makoto Irie, Toyama, JP;
Atsushi Hirakawa, Shiga-ken, JP;
Abstract
A sealing structure and a sealing method for an electronic component achieves desired sealing properties and heat resistance. An electronic component element is mounted on a substrate having an electrode pattern disposed thereon, and is sealed by bonding a cap for covering the electronic component element on the substrate. An adhesive structure used to join the cap on the substrate includes a high-glass-transition-point adhesive partially coated on the cap bonded portion of the substrate, and a low-glass-transition-point adhesive coated over an entire periphery of the opening of the cap. The opening of the cap is pressed on a mounting portion of the substrate, and the adhesives are then cured to bond and seal the substrate and the cap.