The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2000
Filed:
Mar. 22, 1996
Fumio Kurihara, Yokkaichi, JP;
Mitsuyoshi Kumamoto, Suzuka, JP;
Yasuhito Ito, Yokkaichi, JP;
Masanobu Nagano, Yokkaichi, JP;
Jun Nakamura, Ichishi-gun, JP;
Japan Synthetic Rubber Co., Ltd., Tokyo, JP;
Abstract
A process and an apparatus for molding, in which a molten thermoplastic resin is firmly fitted onto a molding surface of a mold under a pressure lower than or equal to 100 kg/cm.sup.2 and is cured to obtain a molded product. The molding apparatus has a mold main body, and a mold body on which the molding surface is defined. The mold body is supported relative to the mold main body with maintaining a space on the back side of the molding surface in a heat insulative manner by a supporting member which includes at least a heat insulative supporting member having a thermal conductivity of 0.001 to 1 Kcal/mh .degree.C. and a longitudinal elastic modulus of 0.01 to 10 kg/cm.sup.2. In the space, a heating fluid for heating the molding surface from the bask side to a temperature higher than or equal to Vicat softening temperate (T) .degree.C. of the thermoplastic resin and a cooling fluid for cooling the molding surface from the back side to a temperature lower than or equal to (Vicat softening temperature (T) of the thermoplastic resin -10) .degree.C. are supplied.