Dual substrate package assembly having dielectric member engaging

Abstract

An electronic package assembly for being electrically connected to a conducting member (e.g., a printed circuit board) wherein the assembly includes a pair of substrates. The first substrate includes opposing circuit patterns, those on one surface being of higher density and thus adapted for having high density electronic devices mounted thereon. This high density pattern is electrically coupled to the lesser density second pattern which is connected to conductors of a second substrate. These conductors are of the lesser density also, and extend through a dielectric member for being coupled to conductors (e.g., copper circuit pads) on the conducting member. These conductors are in contact with the dielectric member at only three locations before the dielectric is connected to the electronic package assembly and the conducting member. Ready separability of various parts of the assembly is thus assured.