The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2000

Filed:

Mar. 18, 1998
Applicant:
Inventors:

Sanjar Ghaem, Palatine, IL (US);

Cindy Melton, Bolingbrook, IL (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
361760 ; 174260 ; 29834 ; 257785 ; 257797 ; 361767 ; 361769 ; 361771 ; 361783 ;
Abstract

A microelectronic assembly and a method for manufacturing the assembly include an integrated circuit component attached to a substrate via polymeric bodies. The integrated circuit component has bond pads that are bonded to corresponding conductive members. The substrate contains terminals associated with conductive traces. The conductive members rest against the respective terminals to form slidable electrical contacts. The slidable electrical contacts permit the transfer of electrical energy between the integrated circuit component and the conductive traces of the substrate. The polymeric bodies preferably comprise elastomers that are spaced from the conductive members, rather than underfilling the integrated circuit component.


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