The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2000
Filed:
Sep. 11, 1998
Kil-Yeong Choi, Daejeon, KR;
Mi-Hie Yi, Daejeon, KR;
Moon-Young Jin, Daejeon, KR;
Jin-Tae Jung, Seoul, KR;
Jeong-Ghi Koo, Kyungki-do, KR;
Jae-Eun Cho, Kyungki-do, KR;
Abstract
The invention herein relates to a soluble polyimide resin for a liquid crystal alignment layer and the manufacturing method thereof, wherein a mixture of aliphatic tetracarboxylic acid dianhydrides and aromatic diamine having aliphatic side chains are used to yield a soluble polyimide resin which has superior heat-resistance, solubility, surface hardness, transparency and liquid crystal alignment capacity. The soluble polyimide resin having alkoxy substituents, for a liquid crystal layer, according to the present invention, is manufactured by adding a mixture of dioxotetrahydrofuran 3-methylcyclohexene-1,2-dicarboxylic dianhydride, which is an aliphatic tetracarboxylic acid dianhydride and aromatic tetracarboxylic acid dianhydride to a mixture of aromatic diamine, and said dioxotetrahydrofuran 3-methylcyclohexene- 1,2-dicarboxylic dianhydride is used in the amount of 50 to 99 mol % to the total amount of anhydrides. The polyimide resin according to the present invention not only has superior heat-resistance and mechanical characteristics but also excellent solubility and transparency, which could be applicable as a liquid crystal alignment layer for the TFT-LCD requiring difficult processing condition such as a low temperature and vigorous rubbing processing. Further, the polyimide resin may be useful as basic heat resistant structural materials for advanced industry.