The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2000
Filed:
Jan. 30, 1998
Applicant:
Inventors:
Ki-hong Lee, Kyungki-do, KR;
Gi-ho Cha, Kyungki-do, KR;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428209 ; 428614 ; 428620 ; 428627 ; 428651 ; 428901 ; 257751 ; 257763 ; 257765 ;
Abstract
Metal wiring structures for integrated circuits include a seed layer formed on an integrated circuit substrate and a wetting layer formed on the seed layer opposite the integrated circuit substrate. A metal wiring layer is formed on the wetting layer opposite the seed layer. The seed layer and the metal wiring layer have the same crystal orientation. In a preferred embodiment, the seed layer is an aluminum layer having (111) crystal orientation and the metal wiring layer includes aluminum having (111) crystal orientation. The metal wiring layer may be aluminum or an aluminum alloy. The wetting layer preferably includes titanium.