The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2000
Filed:
Apr. 01, 1998
James N Humenik, Lagrangeville, NY (US);
Keith C O'Neil, Hughsonville, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Conductive vias in integrated circuit ceramic greensheets are formed with essentially flat exposed surfaces by applying an adherent in situ mask material to the greensheet prior to punching via openings therethrough. The in situ mask material then serves to permit the application of a second overprint conductive paste after the original conductive paste has filled the via opening and formed a depression upon hardening. The second overprint paste fills the depression and leaves an essentially flat top surface. When the in-situ mask material is removed, a slight protuberance of conductive paste remains in a plane vacated by the in-situ mask material (with or without the second conductive paste application). In one form of the invention, this protuberance is compressed back so that it is essentially level with the surrounding ceramic greensheet by the application of pressure thereto, either by a platen or by an adjoining greensheet lamina.