The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2000

Filed:

Dec. 09, 1996
Applicant:
Inventors:

Hirofumi Seo, Tokyo, JP;

Shinichi Hiramatsu, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21F / ;
U.S. Cl.
CPC ...
29 2801 ;
Abstract

A semiconductor device manufacturing machine comprises a mechanism provided in a processing chamber, for lifting up a ring-like peripheral member, and a holder provided at a tip end of a feeding mechanism located in a feeding chamber, and capable of holding either or both a semiconductor wafer and the ring-like peripheral member, so that, in the processing chamber maintained in a vacuum condition, the ring-like peripheral member is lifted up by the lifting mechanism and transferred to the holder of the feeding mechanism, and the ring-like peripheral member held by the holder of the feeding mechanism is moved from the processing chamber through the feeding chamber to a load lock chamber and further can be removed from of the semiconductor device manufacturing machine. Thus, the ring-like peripheral member is held and transferred by the holder for holding and transferring the semiconductor wafer, and therefore, the ring-like peripheral member can be exchanged without breaking the vacuum condition of the processing chamber.


Find Patent Forward Citations

Loading…