Card panel having a bracket with integrally formed track for an emi

Abstract

A card panel includes a conductive bracket and a circuit board coupled to the bracket. The bracket includes a front side, and first and second lateral sides. The board is coupled to an inner surface of the first side of the bracket, while an outer surface of the first side operates as a conductive contact. The outer surface of the second side of the bracket includes an integrally molded T-shaped track, and a hole at each end of the track. An elongate conductive spring having a generally triangular cross-section with two inwardly directed lower flanges and a raised portion is positioned on the track such that each of the lower flanges is held by track and further such that the ends of the spring are positioned between the holes in the track. Rivets are provided in the holes and maintaining the spring on the track. The integrally molded track permits easy installation of the spring to the bracket. The integration of the components provides an assembly having relatively few components and a relatively low cost. Moreover, the molded track is relatively straight, stiff, and more resistant to damage than prior art spring assemblies. As such, the spring has a more uniform compression and is held flat and straight against the bracket. Electromagnetic interference is thereby reduced. Furthermore, should the spring become damaged, the rivets securing the spring may be easily removed to facilitate replacement of the spring.