The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2000
Filed:
Aug. 15, 1997
Applicant:
Inventors:
Kenichi Kuboki, Chiba-ken, JP;
Yoshitaka Kajiwara, Saitama-ken, JP;
Yoshio Shimamura, Ibaraki-ken, JP;
Yasumasa Akatsuka, Saitama-ken, JP;
Assignee:
Nippon Kayaku Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ; C08G / ;
U.S. Cl.
CPC ...
528 98 ; 528102 ; 528104 ;
Abstract
Modified epoxy resin having an elevated softening point obtained from an epoxy resin having a low softening point without modifying the properties of the cured product and to improve the workability in the production of an epoxy resin composition. The modified epoxy resin is obtained by adding 4,4'-dihydroxybiphenyl to a specified phenol compound and epoxidizing the resultant mixture. Also disclosed is an epoxy resin composition containing the modified epoxy resin and the cured product thereof.