The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2000
Filed:
Jun. 19, 1998
Rong-Wu Chien, Hsinchu, TW;
Vanguard International Semiconductor Corporation, Hsinchu, TW;
Abstract
A method of manufacturing a monitor pad for measuring the topographic step height for the CMP planarization process is provided. The monitor pad contains an area having step height lower than the worst condition on the wafer. The method comprises the steps of forming a field oxide area; defining area A, area B, and area C on the field oxide area and area B being located between area A and area C; and forming a multiple layers of polysilicon and metal on area A and area C. Consequently, the step height of area B is lower than the worst condition on the wafer. The step height of the monitor pad will be enough to reflect the polish condition on the surface of the wafer after CMP planarization.