The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2000
Filed:
Mar. 07, 1997
Toshiharu Suzuki, Kanagawa, JP;
Keiichi Maeda, Kanagawa, JP;
Kazuhide Koyama, Kanagawa, JP;
Tatsuji Oda, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
In a method for making a multilayer wiring structure, a second insulating film having an etching rate slower than a first insulating film is provided on the first insulating film covering a wiring pattern; an opening is formed in the second insulating film in a portion corresponding to a connecting hole to be formed afterwards; a third insulating film having an etching rate faster than the second insulating film is provided on the opening and the second insulating film; a groove is formed, so as to expose the opening, in the third insulating film in a portion where an upper-layer wiring pattern is formed, and the connecting hole reaching the wiring pattern is formed; and a connecting plug is formed by packing a conductive material in the connecting hole, and the upper-layer wiring pattern is formed by packing a conductive material in the groove.