Conditioner assembly for a chemical mechanical polishing apparatus

Abstract

A conditioner assembly and a conditioner back support for conditioning a polishing pad of a chemical mechanical polishing device. The conditioner assembly comprises a conditioning head having a gimbal assembly, a shaft engaged to the conditioning head, and a linear torque bearing assembly slidably receiving the shaft. The linear torque bearing assembly is configured to operatively rotate the shaft assembly contemporaneously with allowing the shaft to extend and retract from a first open end of the linear torque bearing assembly. The conditioner assembly additionally comprises a bellows secured over the first open end and engaged to the conditioning head and a bearing housing disposed over a second open end of the linear torque bearing assembly. The bearing housing rotatably supports the linear torque bearing assembly such that a motor assembly can operatively drive the linear torque bearing assembly, the shaft, and the conditioning head. The conditioner back support respectively opposes the conditioner assembly such that the polishing belt supporting the polishing pad is disposed intermediate to the conditioner back support and the conditioner assembly. The conditioner back support comprises a frame assembly which adjustably support a backing plate. The frame assembly comprises a positioning assembly which allows a user to adjust the position of the backing plate. The position of the backing plate can be adjusted such that a front surface of the backing plate is parallel to and disposed on or proximal to a plane defined by a backside of the polishing belt. As a result, when the conditioner assembly compresses against the polishing pad, the polishing pad does not significantly deflect. The conditioner back support further includes a polymeric compound disposed on the front surface of the backing plate for reducing the frictional force between the backing plate and the polishing belt.