The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2000
Filed:
Jan. 19, 1999
Jerry Ihor Tustaniwskyj, Mission Viejo, CA (US);
Leonard Harry Alton, Escondido, CA (US);
Unisys Corporation, Blue Bell, PA (US);
Abstract
An electromechanical module with pressed electrical connections includes the following components: 1) a printed circuit board having a first array of I/O pads; 2) a substrate having a second array of I/O pads that are aligned with and face the first array of I/O pads; 3) compressible electrical contacts which lie between the first and second array of I/O pads; 4) a thin springy plate having a central section which presses against the printed circuit board in line with the first array of I/O pads, and having a springy periphery that extends in a quiescent state away; from the printed circuit board; and 5) a compressing means which compresses the electrical contacts by forcing the substrate towards the printed circuit board while bending the springy periphery of the thin-springy plate towards the substrate. When the plate is in a state where the electrical contacts are fully compressed, the thin-springy plate is relatively flat; and thus, the module has a low profile. Maximum deflection and stress in the printed circuit board are kept below an acceptable limit by selecting the particular locations where the central section of the thin springy plate presses against the board.