The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2000
Filed:
Dec. 23, 1997
Achim Baukloh, Bad Iburg, DE;
Ulrich Reiter, Osnabruck, DE;
KM Europa Metal Aktiengesellschaft, Osnabruck, DE;
Abstract
A copper installation pipe having a tin coating that is applied with temperature control so as to be adherent over the entire inner surface. The thickness of the intermetallic phase formed at the transition from the copper pipe to the tin coating is less than 20%, preferably less than 5% of the overall coating thickness. In addition, a method for coating an installation pipe using chemical treatment, where the temperature of the tinning solution is selectively varied. To ensure the smallest possible intermetallic phase at the copper surface, one begins the tinning process at a low temperature. This promotes the formation of a large number of uniformly distributed nuclei of crystallization having the same orientation. The temperature is then selectively adjusted to promote crystal growth, the result being that the crystals grow rapidly with the orientation remaining constant. One then achieves a dense tin coating having a minimal exposed surface area.