The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2000

Filed:

Feb. 26, 1999
Applicant:
Inventor:

Toshiro Kawanishi, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01H / ; H01H / ; H01H / ;
U.S. Cl.
CPC ...
337297 ; 337231 ; 337296 ; 337404 ; 29623 ;
Abstract

A thin type thermal fuse is structured by a resin base film, a pair of belt-shaped lead conductors, a low melting-point fusible alloy piece, flux and a resin cover film. Tip portions of the pair of belt-shaped lead conductors is fixed on the resin base film. The low melting-point fusible alloy piece is coupled between the tip end portions of the belt-shaped lead conductors. The flux applied on the low melting-point fusible alloy piece. The resin cover film which is disposed on a one surface of the resin base film so that a space between said films at peripheries of both the resin cover film and the resin base film is sealed and a space between the resin cover film and the belt-shaped lead conductors is sealed. In the thin type thermal fuse, a relation of (V/L).sup.1/2 /d.ltoreq.1.8 is satisfied, where a distance between the tip portions of the belt-shaped lead conductors is set to be L, a volume of the low melting-point fusible alloy piece is set to be V and a distance between the front surface of the resin base film and an inner surface of the resin cover film is set to be d.


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