The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2000
Filed:
Apr. 14, 1998
Applicant:
Inventors:
Akihiko Harada, Tokyo, JP;
Keiichi Higashitani, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257752 ; 257750 ; 257751 ; 257758 ; 257774 ;
Abstract
A semiconductor device is formed with interconnections having reduced electric resistance. The semiconductor device comprises an upper wiring formed on an insulating film with a barrier metal therebetween, a conductive plug formed in a plugging space of the insulating film and electrically connected to the upper wiring at an opening of the plugging space, and a sidewall formed on a side surface of the upper wiring, the bottom of the sidewall covering the opening of the plugging space not covered by the upper wiring.