The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2000
Filed:
Mar. 03, 1998
Applicant:
Inventors:
Akira Kitaguchi, Tokyo, JP;
Makoto Hatakenaka, Tokyo, JP;
Michio Nakajima, Tokyo, JP;
Kaoru Motonami, Tokyo, JP;
Kiyoyuki Shiroshima, Hyogo, JP;
Takekazu Yamashita, Nagasaki, JP;
Assignees:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Mitsubishi Electric System LSI Design Corporation, Hyogo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257529 ; 257532 ;
Abstract
A semiconductor integrated circuit includes a fuse element located on an insulating layer. The surface of the insulating layer is substantially smooth. The insulating layer is located over a capacitor. Wiring is located on the insulation layer. The fuse element and the wiring include the same material.