The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2000
Filed:
Jun. 11, 1997
Rolf A Den Dopper, Roosendaal, NL;
Soltec B.V., , NL;
Abstract
A reflow soldering apparatus includes a plurality of heating compartments connected in series for heating objects for soldering; transporting means for successively carrying the objects through the compartments; and at least first and second cooling compartments connected subsequent to the heating compartments for cooling the soldered objects. The first cooling compartment subjects the objects to a first, descending temperature gradient, and the second cooling compartment subjects the objects to a second, descending temperature gradient, wherein the second temperature gradient is steeper than the first temperature gradient. The objects are cooled in the first cooling chamber to a temperature below the solidification temperature of the solder.