The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2000

Filed:

Jun. 06, 1997
Applicant:
Inventors:

Ashwinkumar Chinuprasad Bhatt, Endicott, NY (US);

Subahu Dhirubhai Desai, Vestal, NY (US);

Thomas Patrick Duffy, Endicott, NY (US);

Jeffrey Alan Knight, Endwell, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ;
U.S. Cl.
CPC ...
361795 ; 174255 ; 174258 ; 361764 ; 361762 ; 361707 ; 361719 ; 430312 ;
Abstract

A chip carrier for wire bond-type chips is disclosed. This chip carrier employs organic dielectric materials, rather than ceramic materials, as is conventional. This chip carrier also employs at least one organic, photoimageable dielectric layer, having plated photo-vias, to electrically interconnect two (or more) layers of fan-out circuitry. This chip carrier further employs a single-tiered cavity to contain a chip, rather than a multi-tiered cavity, as is conventional. Moreover, this chip carrier includes thermal via holes and/or a metallic layer, directly beneath the chip, to enhance heat dissipation.


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