The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2000
Filed:
Mar. 24, 1998
Applicant:
Inventors:
Joong-do Kim, Yongin, KR;
Kyoung-soon Bok, Yongin, KR;
Assignee:
Samsung Aerospace Industries, Ltd., Kyonsangnam-Do, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257666 ; 257667 ; 257677 ;
Abstract
A semiconductor lead frame and a fabricating method thereof are provided. The semiconductor lead frame includes a metal substrate, and a multi-layered plating layer including a copper-nickel alloy layer formed on the metal substrate, and a palladium or palladium alloy layer formed on the copper-nickel alloy layer.
Kim, Joong-do. (2000). Semiconductor lead frame having multi-layered plating layer including (U.S. Patent No. 6037653). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6037653
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile