The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2000

Filed:

Dec. 19, 1995
Applicant:
Inventors:

Yasuhiro Endo, Tsukuba, JP;

Yoichi Ueda, Tsukuba, JP;

Toshiaki Hayashi, Tsukuba, JP;

Mitsuhiro Shibata, Tsukuba, JP;

Shuichi Kanagawa, Tsuchiura, JP;

Shinichiro Kitayama, Tsukuba, JP;

Hisashi Watabu, Tsukuba, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G / ; C08G / ;
U.S. Cl.
CPC ...
528211 ; 528170 ; 528214 ; 528216 ; 528219 ; 528422 ;
Abstract

A cyanate resin composition comprising as essential components a cyanate compound represented by formula (1) or its prepolymer and a curing agent: ##STR1## wherein each of R.sub.1 and R.sub.2 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms; A represents an alkyl group having 1 to 3 carbon atoms; i represents an integer of 0 to 3 alone or together with a brominated epoxy compound or a maleimide compound or its prepolymer, said cyanate resin composition giving a cured product having a low-dielectric constant, and a copper-clad laminate composed of a prepreg of said cyanate resin composition and a copper foil.


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