The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2000
Filed:
Jun. 25, 1998
Applicant:
Inventors:
Mikitoshi Satoh, Omuta, JP;
Tsutomu Yamaguchi, Omuta, JP;
Hiroaki Sawa, Omuta, JP;
Kazuyoshi Ikeda, Omuta, JP;
Masato Nishikawa, Omuta, JP;
Assignee:
Denki Kagaku Kogyo Kabushiki Kaisha, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08J / ; C08K / ; C08L / ; B29C / ;
U.S. Cl.
CPC ...
524404 ; 524547 ; 524588 ; 26417717 ; 26421112 ;
Abstract
A rubber molded product containing an inorganic filler, in which the relation of an inorganic filler content and a thermal resistance is within the range enclosed by lines connecting points A (20,1.5), B (20,0.1) and C (50,0.1) in the X-Y coordinates wherein the X coordinate expresses the inorganic filler content (vol %) and the Y coordinate expresses the thermal resistance per 1 mm thickness (.degree. C./W).