The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2000
Filed:
Jan. 22, 1998
Sorin Witzman, Ottawa, CA;
Elizabeth M Tencer, Ottawa, CA;
Michal S Tencer, Nepean, CA;
William T Davies, Kanata, CA;
Richard S Kubin, Carleton Place, CA;
Nortel Networks Corporation, Montreal, CA;
Abstract
A method of assembling an integrated circuit component onto a substrate by the use of a polymer adhesive having fluxing properties and a specified adhesive strength and temperature control volumetric change which is greater than that of a solder to be used between terminals of the component to terminals of the substrate. In the method the uncured polymer adhesive is located between the circuit component and the substrate and as the second component moves into its site position upon the substrate, the uncured polymer adhesive is compressed and is displaced outwardly from between the body of the component and the substrate. In the method, as an exterior force is required to displace the adhesive in this manner, glass microspheres are provided within the adhesive to limit the movement of the integrated circuit components towards the substrate. These microspheres are of a specified grid size and should also be sufficiently large to prevent glass microspheres from becoming trapped between the terminals of the component and of the substrate. The polymer adhesive has fluxing properties which enables it to be partially cured initially to hold the integrated circuit component in its required position, the curing action then being completed during a reflow soldering operation performed to join terminals of the component to the terminals of the substrate.