The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2000

Filed:

Jan. 29, 1997
Applicant:
Inventors:

Gregory Dean Garlough, Bloomington, MN (US);

Benjamin Todd Carroll, Brooklyn Park, MN (US);

Michael Val Carano, Plymouth, MN (US);

Frank Polakovic, Ringwood, NJ (US);

Assignee:

Electrochemicals Inc., Maple Plain, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ; B05B / ;
U.S. Cl.
CPC ...
427600 ; 427601 ; 427 97 ; 427122 ; 205125 ; 205 91 ; 205148 ;
Abstract

A method for treating a non-conductive through hole surface of a printed wiring board is disclosed. A printed wiring board including through holes is cleaned, conditioned, and a conductive coating is applied to the initially-nonconductive through hole by contacting it with a series of baths. The conductive coating, for example a graphite dispersion coating, facilitates later electroplating of the conductive surface. While at least partially immersing the through hole in one or more of these baths, ultrasonic energy is introduced in the bath in the vicinity of the through hole. The ultrasonic energy can be introduced during the entire immersing step, before the immersing step, or both. The ultrasonic energy reduces the formation of blowholes during later processing (and especially soldering) of the printed wiring board. The ultrasonic treatment can also improve the dispersion of the conductive particles in a conductive carbon dispersion, reduce or eliminate the formation of pinhole defects, and provide other advantages.


Find Patent Forward Citations

Loading…