The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2000
Filed:
Nov. 25, 1998
Applicant:
Inventors:
Assignee:
Siemens Aktiengesellschaft, Munich, DE;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
251668 ; 257666 ; 257676 ; 257670 ; 257690 ; 257787 ; 257771 ;
Abstract
A semiconductor component has a semiconductor chip, connection elements, and a housing made of a molding compound. The semiconductor chip has contact pads on a top side. The contact pads are electrically connected to the connection elements via bonding wires. The connection elements overlap the semiconductor chip and they are affixed to the semiconductor chip with an adhesive tape. The adhesive tape has a carrier sheet of aluminum oxide and an adhesive layer applied on both sides of the carrier sheet.