The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2000
Filed:
Jun. 10, 1998
Applicant:
Inventors:
Toshiya Sasaki, Takefu, JP;
Kazuyoshi Uchiyama, Takefu, JP;
Masahiko Kawaguchi, Takefu, JP;
Katsuhiro Misaki, Fukui, JP;
Katsuji Matsuta, Sabae, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ; B23P / ;
U.S. Cl.
CPC ...
29874 ; 29413 ; 294261 ; 839292 ;
Abstract
A method of manufacturing an electronic component includes forming a slit in a connecting electrode located on the surface of a mother substrate such that the slit extends in a direction intersecting a cutting line, and cutting the mother substrate along the cutting line while cutting the connecting electrode having the slit. The connecting electrode is thereby reliably exposed on two opposing cut surfaces, and the reliability of external connection of the electronic component is improved.