The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2000
Filed:
May. 12, 1997
Wilhelm Tamm, Aidlingen, DE;
Ingenieurbuero Tamm Factory Innovations, Deufringen, DE;
Abstract
A method for the production of printed circuit boards comprises the steps of producing recesses (2, 3, 4, 5) and/or through holes (2a) in a substrate (1) made from insulating material, in particular by means of laser-ablation, wherein the recesses and/or through holes correspond to the desired structure of conductive tracks and/or plated through holes; introducing a base layer (6) on one or both sides of the substrate (1); and introducing a conductive material (7) onto the base layer (6) which is catalytic and/or activating relative to the conductive material (7). The base layer (6) is selectively removed from the substrate (1), except in the recesses and/or in the through holes, by means of laser-ablation prior to introduction of the conductive material (7). Processing of the surface of the conductive material, the base layer or of the substrate is no longer necessary.