The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2000

Filed:

Jan. 27, 1999
Applicant:
Inventors:

Jay K Osborn, Alameda, CA (US);

Howard W Stolz, Soquel, CA (US);

Clifford B Willis, Tracy, CA (US);

Assignee:

Sun Microsystems, Inc., Palo Alto, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361690 ; 361687 ; 361695 ; 361697 ; 361715 ; 312236 ; 174 151 ; 174 161 ; 165121 ; 165146 ; 454184 ; 622592 ; 62404 ; 62407 ;
Abstract

A computer system including a highly efficient forced air cooling subsystem is disclosed. The computer system includes an enclosure having a first (e.g., front) panel, a processor mounted upon a motherboard located within the enclosure, and a fan located within the enclosure for providing a flow of air through the enclosure. The fan draws air into the enclosure through an opening (e.g., an intake vent) in the first panel and produces a pressurized stream of air. The fan may be oriented such that the pressurized stream of air is directed toward the processor. The computer system may also include a plenum adjacent to the first panel, wherein the intake vent allows ambient air surrounding the enclosure to enter the plenum. The fan may be mounted within an opening in a wall of the plenum. The enclosure may also include a second (e.g., rear) panel opposed to the first (e.g., front) panel and having three openings (e.g., exhaust vents) therein. A first portion of the pressurized stream of air may flow across the processor and exit through a first exhaust vent. A second portion of the pressurized stream of air may flow through a power supply located within the enclosure and exit through a second exhaust vent. A third portion of the pressurized stream of air may flow through a space within the enclosure reserved for option cards and exit the enclosure through a third exhaust vent.


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