The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2000
Filed:
Oct. 30, 1997
Applicant:
Inventors:
Mukesh P Patel, Boise, ID (US);
Amit P Agrawal, Mountain View, CA (US);
Assignee:
Hewlett-Packard Co., Palo Alto, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257698 ; 257 48 ; 257692 ;
Abstract
A low inductance integrated circuit package such as a ball grid array having mounting conductors formed on a first side thereof and a die attachment region formed on second side thereof. A plurality of conductors internal to the package interconnect the mounting conductors to the die attachment region. A plurality of diagnostic contact pads are connected to the conductors and configured for ready access by a test probe. The contact pads are preferably provided at a periphery of the package.