The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2000
Filed:
Dec. 01, 1997
Masatoshi Tokunaga, Chiryu, JP;
Denso Corporation, Kariya, JP;
Abstract
A molded IC having external terminals are fixed to a casing. The casing is provided with terminals by insert molding. Then, the external terminals of the molded IC are respectively fixed to the terminals fixed to the casing. In this case, a pitch L.sub.1 of the external terminals of the molded IC and a pitch L.sub.2 of the terminals fixed to the casing are chosen so that a difference between a product of the pitch L.sub.1 and a thermal expansion coefficient of resin for the molded IC and a product of the pitch L.sub.2 and a thermal expansion coefficient of resin for the casing becomes as small as possible. As a result, fixed portions between the external terminals of the molded IC and the terminals fixed to the casing can be prevented from being subject to excessive stress, even when the molded IC and the casing are thermally expanded.