The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2000
Filed:
Jun. 23, 1998
Applicant:
Inventors:
Tsutomu Takahashi, Ibaraki, JP;
Yoshifumi Tsujimoto, Ibaraki, JP;
Hiroaki Kumada, Ibaraki, JP;
Hiroyuki Sato, Ibaraki, JP;
Assignee:
Sumitomo Chemical Company, Limited, Osaka, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23B / ;
U.S. Cl.
CPC ...
428209 ; 4282974 ; 4283066 ; 428361 ; 428378 ; 428395 ; 428396 ; 428408 ; 428458 ; 4284744 ; 428901 ; 428910 ; 174258 ; 361750 ;
Abstract
The present invention provides a printed circuit substrate comprising a lightweight prepreg and a conductive layer. The prepeg having uniform formation, low linear thermal expansion coefficient and good mechanical strength, comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or the thermosetting resin, a process for producing the same, and a printed circuit substrate/board using the same.