The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 29, 2000
Filed:
Mar. 06, 1998
Nalini Ranjan, San Jose, CA (US);
Henry Yang, San Jose, CA (US);
Yi-Hen Wei, San Jose, CA (US);
Gregg Bardel, San Jose, CA (US);
S3 Incorporated, Santa Clara, CA (US);
Abstract
Improved conductive pads and conductive lines for use on integrated circuit chips include one or more conductive layers having a wider width than convention conductive lines for improved current and power carrying capacity. A layer of insulating and shock resistant is included over said layers of wider width, and additional pads can be formed on said layer of insulating and shock resistant material. Additional improved conductive pads are formed on the integrated circuit chip over a region containing a conductive line. The improved pads and conductive lines provide high power and current carrying capacity, and simultaneously allow for high pad density on an integrated circuit chip. Said pads and conductive lines can include a layer of metal which is electrically insulated using upper and lower layers of insulating material, with this layer of metal providing shock resistance particularly to such lower layer of insulating material.