The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 29, 2000
Filed:
Oct. 06, 1997
Chwan-Ying Lee, Tainan, TW;
Tzuen-Hsi Huang, Tou Lin, TW;
Industrial Technology Research Institute, Hsin-Chu, TW;
Abstract
The present invention provides a method of manufacturing an inductor element 46 using an electroless Au plating solution. The invention has three embodiments for forming the inductor. In the first embodiment, a first insulating layer 30 is formed over a semiconductor structure 10 20. An adhesion layer 34 composed of polysilicon is formed over the first insulating layer 30. A first barrier layer 36 comprised of Ni is selectively formed using an Ni electroless plating process over the adhesion layer 34. In an important step, a gold layer 40 is electroless plated over the first barrier layer 36 using an Au electroless plating process. A second barrier layer 44 is formed over the gold layer 40 using an electroless Ni deposition technique. A planarization layer is formed over the second barrier layer. A novel core metal layer composed of a Fe--Co alloy is electroless plated over the planarization layer. The second and third embodiments vary in the process of defining the gold electroless inductor by forming the inductor in a trench. The gold electroless inductor 46 can withstand high current densities without suffering from electromigration effects and is highly corrosion resistant.