The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 29, 2000
Filed:
May. 22, 1997
Yoshinori Nakane, Kanagawa-ken, JP;
Hiroki Mizutani, Chigasaki, JP;
Hayato Ishibashi, Yokohama, JP;
Masahiro Ishidoya, Chigasaki, JP;
NOF Corporation, Tokyo, JP;
Abstract
A method of molding which comprises preparing a molding material by compounding a filler and a curable composition, the filler being in an amount of 0 to 800 weight parts based on 100 weight parts of the curable composition and optionally aging the molding material at room temperature or by heating, followed by casting the molding material into a mold and curing the molding material under atmospheric pressure or higher, and articles molded by such method. The curable composition comprises: (A) a compound having in the molecule two or more specific blocked carboxyl groups, (B) a compound having in the molecule two or more reactive functional groups which can form chemical bonds with the blocked carboxyl groups, and (C) a catalytic component selected from the following: (a) a thermal latent acid catalyst which comprises a compound having a epoxy group, a specific compound having a sulfur atom and a Lewis acid; (b) a thermal latent acid catalyst which comprises a compound having at least one nitrogen atom, oxygen atom, phosphorus atom or sulfur atom, a compound having a halogen atom and a Lewis acid having at least one aluminum atom, zinc atom or tin atom; or a mixture which comprises (c) a metallic chelate compound and an organic silicon compound or a condensate thereof.