The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2000
Filed:
Jan. 28, 1997
Satoru Kamitani, Kagoshima, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
In an electrostatic chunck with grooves formed on the dielectric layer surface, the rate of foreign matter adhering to the semiconductor wafer is reduced and at the same time the semiconduticor wafer can be uniformly heated without causing leakage of lie or other gases supplied to the grooves of the said holding surface into the chamer. The electrostatic chuck is composed of a dielectric layer made from ceramics or sapphire which has electrostatic electrodes, holding surface positioned on a same plane and concave spaces positioned next to the holding surface, at least one of the said holding surface being circumference, and the outermost such holding surface having a width of 1-20 .mu.m and being a smooth surface having a center line average roughness (Ra) of 0.3 .mu.m or less.