The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2000

Filed:

Sep. 05, 1997
Applicant:
Inventor:

Joel D Bickford, Santa Rosa, CA (US);

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P / ;
U.S. Cl.
CPC ...
333260 ; 333 / ; 333 / ;
Abstract

A low inductance interconnect suitable for microwave frequency interconnect applications. The invention provides a low inductance interconnect structure providing interconnection operable from DC to beyond 100 Ghz. The structure may be in the form of a resilient comb, and can be cut from thin sheet metal with a Wire Electric Discharge Machine (EDM). Other resilient forms include spring structures, resilient canes and conductive fuzz.


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