The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2000

Filed:

Sep. 11, 1998
Applicant:
Inventor:

Masaaki Abe, Kumamoto, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257779 ; 257738 ; 257780 ;
Abstract

The present invention provides a land comprising a recess formed in a packaging portion for receiving a solder ball. The land has a main part having a size which is slightly larger than a size of the solder ball for receiving the solder ball, wherein the land further has at least a flux-escape part extending outwardly from the main part so as to form a sufficient space for allowing any excess amount of a flux to escape into the flux-escape region.


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