The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2000
Filed:
Jun. 10, 1998
Applicant:
Inventor:
Floyd K Eide, Huntington Beach, CA (US);
Assignee:
Irvine Sensors Corporation, Costa Mesa, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257686 ; 257685 ; 257398 ; 257696 ; 257723 ; 257730 ; 257666 ;
Abstract
A structure and process are disclosed in which IC chip-containing layers are stacked to create electronic density. Each layer is formed by mechanically and electrically joining an IC-containing TSOP with an external leadframe. Each leadframe contains conductors which are disposed to connect with TSOP leads, transpose signals to other locations on the periphery of the TSOP, and/or connect with other layers in the stack. The TSOP/leadframe layers are stacked and joined, and the leadframe terminals of the lowest layer are disposed to facilitate connection with a PCB or other circuitry.