The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2000
Filed:
Jan. 14, 1998
Applicant:
Inventors:
Toshio Shiobara, Gunma-ken, JP;
Takayuki Aoki, Gunma-ken, JP;
Shigeki Ino, Gunma-ken, JP;
Eiichi Asano, Gunma-ken, JP;
Satoshi Okuse, Gunma-ken, JP;
Kazutoshi Tomiyoshi, Gunma-ken, JP;
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; C08K / ; C08L / ;
U.S. Cl.
CPC ...
428413 ; 523427 ; 525489 ;
Abstract
An epoxy resin composition comprising a crystalline epoxy resin, a phenolic resin, and an inorganic filler is improved in moldability by previously reacting phenolic hydroxyl groups on the phenolic resin with epoxy groups on the crystalline epoxy resin to form a reaction product and blending the reaction product in the composition. The composition is moldable over semiconductor devices without voids and wire flow. The encapsulated semiconductor devices thus remain reliable.