The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2000

Filed:

Sep. 29, 1997
Applicant:
Inventors:

Masahiko Higashi, Kagoshima-ken, JP;

Kouichi Yamaguchi, Kagoshima-ken, JP;

Masanari Kokubu, Kagoshima-ken, JP;

Hitoshi Kumatabara, Kagoshima-ken, JP;

Noriaki Hamada, Kagoshima-ken, JP;

Kenichi Nagae, Kagoshima-ken, JP;

Michio Shinozaki, Kagoshima-ken, JP;

Yasuhide Tami, Kagoshima-ken, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428209 ; 428210 ; 257720 ; 257693 ; 257780 ; 257781 ;
Abstract

A structure for mounting a wiring board in which the wiring board including a ceramics insulating board, metallized wiring layers arranged on said insulating board, and a plurality of connection terminals mounted on said insulating board and electrically connected to said metallized wiring layer, is placed on a mother board having wiring conductors formed on the surface of an insulator which contains an organic resin, and the connection terminals of said wiring board are connected by brazing to the wiring conductors of said mother board, wherein a value F1 defined by the following formula (1):


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