Resin-sealed semiconductor device, circuit member for use therein and

Abstract

There is disclosed a resin-sealed semiconductor device which comprises plural terminal portions integrally having inner terminals on surfaces and outer terminals on back surfaces and being disposed electrically independent of one another in such a manner that inner terminal surfaces are positioned on substantially the same plane; a die pad integrally provided with plural inner terminals on a surface and plural outer terminals on a back surface and being disposed electrically independently in a substantially center portion of the plane in which the plural terminal portions are arranged two-dimensionally; a semiconductor element electrically insulated and mounted on a surface of the die pad; and wires for connecting the inner terminals of the terminal portions and terminals of the semiconductor element. The whole is sealed with a resin in such a manner that the outer terminals of the terminal portions are partially exposed to the outside. In the device, the outer terminals integrally formed on the back surface of the die pad function as a heat release path for allowing heat generated on a circuit forming face of the semiconductor element to escape to the outside, and also function as ground terminals. Furthermore, when the die pad is divided into plural die pad pieces, the outer terminals provided on the back surfaces of the die pad pieces function as power terminals in addition to the aforementioned functions. Moreover, by forming outer electrodes on the outer terminals, a BGA (Ball Grid Array) type semiconductor device can be provided.