The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 15, 2000

Filed:

Apr. 29, 1998
Applicant:
Inventors:

Kazuo Saito, Tokyo, JP;

Atsushi Hagiwara, Tokyo, JP;

Fumio Tanno, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C01B / ;
U.S. Cl.
CPC ...
264 296 ; 264 85 ; 264105 ; 264126 ; 264241 ; 264347 ;
Abstract

The present invention provides a carbon composite material which is a molded material comprising (a) an expanded graphite powder and (b) a thermoplastic resin or a thermosetting resin or a fired product of the thermosetting resin, and the expanded graphite powder (a) being dispersed in the component (b), wherein the expanded graphite powder has an average particle diameter of 5-12 .mu.m and at least 80% of the total particles of the expanded graphite powder have particle diameters of 0.1-20 .mu.m; and a process for producing a carbon composite material, which comprises mixing and dispersing a thermoplastic or thermosetting resin and the expanded graphite powder as mentioned above, and then pressure-molding the resulting mixture at room temperature to 400.degree. C., or a process for producing a carbon composite material, which comprises mixing and dispersing a thermosetting resin and the expanded graphite powder as mentioned above, pressure-molding the resulting mixture at room temperature to 400.degree. C., and firing the resulting molding at 700-3,000.degree. C. in a non-oxidizing atmosphere. The carbon composite material produced by the above process is free from the problems of the prior art and is superior in both gas non-permeability and electroconductivity.


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