The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2000
Filed:
Jul. 17, 1998
Applicant:
Inventors:
Hiroyuki Hirata, Neyagawa, JP;
Yuuichi Komizo, Nishinomiya, JP;
Yasuto Fukada, Hachioji, JP;
Masakatsu Ueda, Shiki-gun, JP;
Assignee:
Sumitomo Metal Industries, Ltd., Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ; B23K / ;
U.S. Cl.
CPC ...
228194 ; 228203 ; 228231 ; 228232 ; 22826241 ; 148534 ; 2852881 ;
Abstract
The method provides a diffusion-bonding of dual-phase stainless steel material having excellent strength and corrosion. The method includes: cold-working a material to be bonded so as to enhance the proof stress; inserting into the bonding portion an insert material; applying pressure thereto while performing shielding by mixed nitrogen/argon gas; heating the restricted bonding portion; cooling at a restricted rate; so as to form a bonded portion having the ferritic phase percentage of 30-70% by volume.