The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2000
Filed:
Feb. 27, 1998
Applicant:
Inventors:
Yuji Hotta, Osaka, JP;
Amane Mochizuki, Osaka, JP;
Michie Sakamoto, Osaka, JP;
Masahiro Yoshioka, Osaka, JP;
Assignee:
Nitto Denko Corporation, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257687 ; 257729 ; 257787 ; 257788 ; 257790 ;
Abstract
A semiconductor device with a metal foil and a sealing resin material. Metal foil is formed integrally with the sealing resin layer.
Hotta, Yuji. (2000). Semiconductor device having metal foil integral with sealing resin (U.S. Patent No. 6023096). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6023096
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile