The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2000
Filed:
Aug. 13, 1998
Robert J Neville, Jr, Mendon, MA (US);
Daniel Hodgkins, Milford, MA (US);
Data General Corporation, Westboro, MA (US);
Abstract
A heatsink assembly for removing at least some of the heat produced by an electronic component during use includes a heatsink, a heatpipe mounted on the heatsink and a plurality of thin, elongated fins mounted on the heatpipe. The heatsink is an elongated, generally rectangularly-shaped body and comprises a bottom surface, a top surface and a central, cylindrical channel formed in the top surface. A pair of clip recesses are formed in the top surface of the heatsink on opposite sides of the central channel. A first set of thin, elongated fins and a second set of thin, elongated fins are also formed in the top surface of the heatsink and serve to remove at least some of the heat transferred onto the heatsink. The heatpipe comprises an evaporator section and a condenser section. The evaporator section of the heatpipe is disposed tightly within the central channel of the heatsink so as to maximize the transfer of heat from the heatsink to the heatpipe. The plurality of thin, elongated fins are disposed on the condenser section of the heatpipe in a closely spaced parallel relation and serve to remove at least some of the heat transferred onto the heatpipe.