The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2000

Filed:

Apr. 09, 1998
Applicant:
Inventors:

Charles M Newton, Palm Bay, FL (US);

William D Killen, Satellite Beach, FL (US);

Thomas P Smyth, Palm Bay, FL (US);

Assignee:

Harris Corporation, Melbourne, FL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ; H01Q / ;
U.S. Cl.
CPC ...
343872 ; 3437 / ; 29848 ; 29846 ; 174255 ;
Abstract

A method for making an RF device, such as an antenna, having a non-planar shape with a high degree of accuracy includes the steps of forming an electrical conductor pattern on a flexible substrate, and positioning the flexible substrate onto the mold having the non-planar shape so that the electrical conductor pattern is exposed. The method also includes forming a rigid layer on the flexible substrate so that the exposed electrical conductor pattern will be transferred to the rigid layer upon separation from the flexible substrate. The rigid layer is separated from the flexible substrate with the electrical conductor pattern remaining on the rigid layer. The method preferably further includes forming an additional thickness of conductive material onto the electrical conductor pattern remaining on the rigid layer. The electrical conductor pattern may be a metal pattern which may be printed onto the substrate. In other embodiments, the electrical conductor pattern on the flexible substrate may be replaced by a seed material that will later be receptive to metal deposition to the define the conductive portions.


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